USE

Gypsum-based compound for filling and reinforcing joints with gypsum cardboards, as well as for filling uneven surfaces on boards (screws, various damages, etc.).

PREPARATION AND APPLICATION

The substrate on which the gypsum compound is applied must be solid, clean and dry, with poorly bonded parts, grease stains, etc. The preparation of the compound is performed by mixing the powder with about 55% of water ( 2.75 l of water for 5 kg of product) with constant mixing with an electric mixer until complete homogenization. The filling is carried out in a certain thickness until leveling with the surface of the boards. The width of the applied layer should be 20-25 cm, and then a reinforcement tape is placed on thus applied layer and is lightly pressed with a trowel. After drying the first coat, the second coat of BK-Fil is applied in a width of 25-30 cm, which levels the surface being reinforced. After drying, remove any creases with sandpaper. The drying time of the filler under normal conditions (T=+23-25 ºC, relative humidity=50-60%) is about 12 h.

APPLICATION TEMPERATURE

The air and substrate temperatures during installation should be in the range from +5 ºC to +30 ºC.

SHELF LIFE AND STORAGE

12 months in original packaging in dry room on pallets.

CONSUMPTION

Approx. 0. 35-0. 45 kg/m².

PACKAGE

5 kg